ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,826, issued on Nov. 3, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package and manufactur... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,827, issued on Nov. 3, was assigned to MediaTek Inc. (Hsinchu City, Taiwan). "Multi-die QFN hybrid package" was invented by Hsin-Long Chen (... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,828, issued on Nov. 3, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device and method of manufacturing semiconductor de... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,829, issued on Nov. 3, was assigned to Absolics Inc. (Covington, Ga.). "Packaging substrate having cavity portions and method of manufacturi... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,830, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package and substrate for sem... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,831, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package having a double via" was... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,832, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and method of fabri... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,833, issued on Nov. 3, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Interconnect substrate, method of making the sa... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,834, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Manufacturing method of package struc... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,835, issued on Nov. 3, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Bonded structure with interconnect... और पढ़ें